0102030405
Tape Automated Bonding (TAB)
Description
JXL provides the largest array of TAB bonding tools (Tape-Automated Bonding Tools) on the market. Our TAB applications cover Insulated Wire Bonding, Ribbon Mesh Bonding, Micro BGA Bonding, Tamping, and Lead Beam Bonding.
If you need to purchase TAB tools, feel free to contact us. We have stock of our standard wedges, and we can also provide a design for custom wedges within three days and ship them out within a few days.
The connections between the die and the tape in the context of Tape Automated Bonding are referred to as inner lead bonds (ILB), while those linking the tape to the package or external circuits are known as outer lead bonds (OLB).
Tape Automated Bonding typically employs single-sided tape, although two-metal tapes are also an option. Copper, frequently used in tapes, can be applied to the tape through electrodeposition or adhesives. Metal circuit patterns are transferred onto the tape using photolithography.
Polyimide tapes come in standard widths of 35 mm, 45 mm, and 70 mm, with thicknesses ranging from 50 to 100 microns. As the tape is in a rolled form, the circuit length is measured in sprocket pitches, with each pitch measuring about 4.75 mm. Consequently, a circuit size of 16 pitches translates to roughly 76 mm in length.
Advantages of Tape Automated Bonding include:
It enables the use of smaller bond pads and finer bonding pitch.It allows for bond pads to be placed all over the die, not just on the periphery, increasing the potential I/O count for a given die size.
It reduces the amount of gold needed for bonding.It minimizes variations in bonding geometry.It has a shorter production cycle time.
It leads to improved electrical performance, including reduced noise and higher frequency.It enables physical flexibility in the circuit.
It facilitates the manufacturing of multi-chip modules.
However, Tape Automated Bonding also has some disadvantages:
It requires time and cost for fabricating the tape.The tape pattern needs to be customized for each die.
There is a capital expense for TAB equipment, as manufacturing requires different machines from those used in conventional processes.
Therefore, Tape Automated Bonding is a preferable alternative to conventional wirebonding when very fine bond pitch, reduced die size, and higher chip density are desired. It is particularly well-suited for circuits that need to be flexible, such as those found in printers, automotive applications, and folding gadgets. It is generally more cost-effective for use in high-volume production, where the returns on the time and cost of developing the tape can be maximized.