0102030405
Small Wire Bonding Wedges By JXL
Description
If you need to purchase standard small wire bonding wedges or require custom wedges, feel free to contact us. We have stock of our standard wedges, and we can also provide a design for custom wedges within three days and ship them out within a few days.
Our range of small wire bonding wedges supports Au, Al, and Cu wires with diameters ranging from .0005” to .003” (13 microns to 76 microns). These wedges are equipped with cutting-edge technical features in semiconductor wire bonding tool designs and are extensively utilized by bonder manufacturers worldwide.
-UT/US Series - Universal
The UT/US series encompasses all the typical characteristics of a standard wedge, including the cavity guide and square back radius, which are commonly employed by most bonder manufacturers. This tool style is predominantly utilized for small wire applications where fine pitch bonding is unnecessary.
-30COB Series – Chip On Board
The 30COB series features a standard 30° feed wedge designed specifically for the common auto-wedge bonder used in aluminum wire bonding chip-on-board applications. It adheres to the features of the UT series wedge with the cavity guide, but it is equipped with an elliptical back radius.
-ABT Series - Autobonding
The ABT series incorporates all the common features of a wedge with the cavity guide design, widely utilized for small aluminum wire bonding. It includes an elliptical back radius, which ensures the wire remains centered within the tool for improved bond placement capability.
-FP Series - Fine Pitch
The FP series integrates the optimal features of ABT and US series designs and often includes a side relief VR feature for fine pitch applications.
-NT/NS Series - Notch
The NT/NS series adopts a standard V-notch design for small aluminum wire, commonly employed in conventional manual bonding machines.
-M Series - Microwave
The M series is a V-notch tool design with a short bond foot for small bonding pads, prevalent in microwave devices.
-RW Series – Ribbon Wire
The RW series serves as a bonding tool for small ribbon wire, accommodating ribbon sizes ranging from .0020"/50 microns up to .0200"/500 microns.
Benefits of Fine-pitch Applications:
As electronic devices become more intricate and smaller in size, the demand for closely spaced wires or pitches has increased. Achieving finer pitches requires the use of smaller diameter wires in all bonders, including ball and wedge techniques. However, reducing wire diameter can result in reduced strength, stiffness, electrical conductivity, and thermal conductivity. The decreased strength and stiffness of smaller diameter wire can negatively impact performance and reliability. This is where wedge-wedge bonding offers its advantages. By directly deforming the wire without forming a ball first, wedge-wedge bonding achieves a stronger weld with minimal deformation, even in smaller sizes.
Advantages of Wedge-Wedge Bonding:
-Because the first and second bond are of the same type, bonding can be done from chip to substrate or in the opposite direction.
-Improved Looping – Wedge bonders naturally achieve the lowest possible loop heights.
-Another advantage is that heating the component is not required when bonding with aluminum wire.