Die Bonding Tools and Collets

The die bonding process occurs before wire bonding, where the chosen die is positioned in a package and connected mechanically using either eutectic or adhesive methods.

Die collets are essential for processes requiring precise die positioning. They minimize contact between the die and the attachment tool while providing a secure grip, particularly beneficial in eutectic die bonding and for MEMS devices where the upper surface must remain untouched.

The Flat Face Pick Up tool is utilized in Thermo-compression or Epoxy Die Attach processes for the tasks of picking up, holding, transferring, and placing a die onto the substrate.

JXL also provides a wide range of Vacuum Pick Up tools suitable for various applications, from standard to high-temperature resistant materials, including plastics, ceramics, and metals, tailored to the specific die-attach process.

Additionally, JXL manufactures die eject needles and epoxy stamping tools, featuring bar, star, and pin patterns. These tools are compatible with all major die bonding machine models.