Micro Hole machining

We provide high-precision micro hole machining services for hard and brittle materials, including SiC, Al₂O₃, Si₃N₄, glass, and sapphire. With dimensional accuracy down to ±1 μm and high aspect ratio capability (>10:1), our processes are suitable for semiconductor equipment, advanced packaging, and microfluidic applications.

Machining Type Micro hole precision machining
Minimum Hole Diameter ≥ 0.08 mm (depending on material)
Dimensional Accuracy ±1 μm
Hole Diameter Tolerance (Top / Bottom) ≤ 3 μm
Aspect Ratio (Depth / Diameter) 10:1
Hole Geometry Straight hole, high-uniformity hole array

Product Detail

Micro Hole machining services

We offer advanced micro hole precision machining services for hard and brittle materials used in semiconductor and high-end industrial applications. Our capabilities are built on more than ten years of experience in manufacturing wedge wire bonding tools, where ultra-precise micro holes and complex micro-features in materials such as tungsten carbide, alumina, and advanced ceramics are essential for product performance and reliability.

Processable Materials

Silicon Carbide (SiC)
Alumina (Al₂O₃)
Silicon Nitride (Si₃N₄)
Glass / Quartz
Sapphire
Tungsten Carbide