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Jxl3001w - Manual And Semi-Auto Wedge Bonder Wire Bonder
MANUAL and SEMI-AUTO WEDGE BONDER WIRE BONDER FEATURES
♦ Loop height and length are automatically adjustable, and with the function of automatic loop starting to enhance loop consistency and reduce the need for operator skill and proficiency.
♦ Real-time monitoring during bonding effectively ensures bond quality.
♦ Online and easy switching between manual and semi-automatic functions provides flexibility, convenience, and improved product compatibility.
Advantage
Advantage 1: Flexibility
♦ Utilizes a high-efficiency ultrasonic transduction system for well-shaped bonded balls
♦ Platform wire breakage mode prevents virtual bonding
♦ Segmented bonding capability adapts to uneven or inclined chip surfaces in RF and microwave field
Advantage 2: Reliability
♦ Coordinated wire clamp action makes loop initiation effortless for operators
♦ Optimized reversal height and distance enable long loops of over 3mm
Advantage 3: Uniformity
♦ Real-time bond formation monitoring ensures high-quality and consistent results
♦ Graphical display of bond deformation for quality control
♦ The automated aligning function allows operators to create the first loop, after which the remaining loops are completed automatically, resulting in high efficiency
Parameters
XYZAxis |
Bonding Force |
14mm*14mm*15mm(Can be customized to28mm*28mm*30mm) |
10-250g accuracy 0.1g, online programmable |
Wire Diameter |
Ultrasonic Power |
|
Gold wire 18-50um Aluminum wire 20-75um Gold Ribbon 25*12.7um-250*12.7um |
0-5W |
Cavity Depth |
Device Size |
Up to 18mm;Compatible with 16/19/25mm wedges |
Compatible with 200mm or bigger |
Wire Spool |
Liftable Operating Table |
Compatible with both 1/2" and 2" wire |
250mm*250mm*18mm |
Dimensions |
Weight |
800mm width*550mm depth*500mm height |
70kg |
Power Supply |
Compressed Air |
|
AC220V±10%@50HZ,10A Smaller than 400W |
>0.2MPa, flow rate>50LPM Purify air source |